BGA3000 Rework Station/ Repair System/ Pick and Place Machine

Technology parameters: * max BGA size: ≤ 50mm x 50mm * min BGA size: 7× 7mm * accuracy: ± 10um * PCB size: 400× 350mm Max strength power: 2.0N Image output signal: PAL Dimension: 450 * 550 * 600mm Net weight: 35Kg Power: 220v, 50Hz Power supply: 200w Lamp-house: LED lighting, red LED illuminate on chips while green on PCB surface board. The intensity of the ray could be controlled to strengthen the image contrast. Air supply: Industry Diaphragm Pumps improve big size BGA mounter efficiency. Performance: 1. Special precision apparatus beeline trace and circumgyration flat could achieve 2μm resolving power in the range of 13mm and 2 degree exact regulation. 2 Light intensity control technology can come ture any area and any brightness PCB lighting and enhance picture contrast. 3 Advanced optics system make sure the BGA component pin and PCB pad imaging at the same time. Single wave prism control the polarization ray effectively and improve the definition of image. 4 Professional nozzle has a reliable and steadly suction to pick up the chips cooperating with Industry Diaphragm Pumps. 5 High definition CCD outputs PAL and VGA signals to achieve the contact of industry monitor and PC display. 50X optics magnifier make the orientation easy and accurate Main accessories: 1 absorb tray 2 X adjusting handle 3 Y adjusting handle 4 θ adjusting handle 5 air tube 6 pump 7 light supply 8 fixing handle 9 PCB working table 10 handle 11 control box 12 monitor