Hot Air Rework Station (BGA3200)

Optical position picking system: A. High precision line orbit and rotary platform can achieve four degree adjustment of X-Y-Z and nozzle angle Φ (turn 360° ) B. Exact optical picking system is made up of CCD camera optical components and light supply which generate by double color prismatic technology (have been patent), it can observe and achieve superposition between PCB pad and foot of components. Max BGA size is 20*20mm. Max is 50*50mm. C. High definition CCD camera can provide PAL and VGA two lines output signal, with zooming in, adjusting, foci automatically, software operation, 30X optical lens, clearly showing BGA and PCB on the screen. D. The accuracy of BGA3200 is ± 0.02mm. Hot air reflow welding system: 1. Top and bottom temperature zones are heat and controlled (controlling and measuring temperature) independently. Infrared pre-heat on the bottom, hot air heat on the top. 2. Using international advanced infrared heating board on the bottom to avoid PCB warping because of asymmetrically heating. Infrared is 2-8 µ M unvisible light(wave length is 2-8µ M, the feature is same absorb and refraction for white and black, avoid temperature difference because of different position), the working life is 10 thousand hours. 3. Top heating head is import from Germany, the special structure can generate stable and equal rotate air to get perfect effect. Replace nozzle is easy, any angle in 360° Can be set. Software controlling system 1. Software controlling system can control unsolder and weld process, different BGA welding profile and reworking profile can be set in computer according to detail request. 2. Every profile can achieve 40 temperature point simulation. (40 segment temperature profile can be controlled. ) to improve welding effect. Using two measuring temperature head, one is used measuring and controlling in heating zone, the other is used measuring real temperature of solder components which is better to amend temperature in heating zone. 3. Automatically generating reflow welding temperature profile when welding and save in computer which can be use at any time. LCD screen can display profile. It can show two group temperature parameter and working time. 4. With good quality PC machines( windows XP) system and BGA rework software, it can set technology parameters according to different components. BGA3200: Dimension 1100mm*720mm*620mm Total power: 2000W Top heating power: 800W Bottom pre-heating power: 1200W Voltage: 220V(50Hz) Controlling mode: Manual/automatic/program Picking accuracy: ± 0.02mm Position system: Double prismatic technology PCB size: Max400*300mm, Min30*10mm PCB thickness: 0.5-3mm Software controlling system Base on windows software Picking components size: Max20*20mm, Min7*7mm Picking strength: 2.0N Temperature controlling system: Intelligent temperature controlling system, closed loop control PCB transmission: Automatic move PCB drive Precision orbit Profile: 40 segment temperature Weight: About 80kgs Accessory Computer 1 set(standard configuration) BGA reball kit 1( standard configuration ) Flux solder 100g ( standard configuration ) Flux tin 1( standard configuration ) Clean water 1( standard configuration )