Wafer Cutting & Laminating Machine for Wafer Line

This wafer cutting machine can automatically cut the cooled wafers into pieces according to required sizes. Technology and function Materials: Adopt imported stainless steel; German SEW motor. Different sizes of wafers can be cut by replacement of cutting knife. Automatical process, can cut 16 pieces per minute. Cutting method: Blade or steel wire type. External dimension(L× W× H): 2m× 2m× 0.87m Total power: 0.75KW Add to Basket