HDI printed circuits

1). 1+C+1 HDI, buried/blind L1-L5/L5-L8 vias.2). FR-4 Material, 1 oz weight.3). 8 layer, 1.6mm thick.4). 4/4 mils track and space5). Min.drill 0.1mm6). Green solder mask/ white silkscreen7). Immersion gold over nickel