Intelligent BGA Rework Station VIP560

BGA three zones rework station VIP560 Rework station VIP560, this machine can heat at the top and bottom with hot air, the third zones is infrared heating, with support at the bottom to avoid PCB distortion, it can be controlled by computer. BGA, CSP, LGA( Land Grid Array), Micro SMD, MLF (Micro-Lead Frame ), BCC ( Bumped Chip Component ) and other chips can be deal. It is best equipment for PCB especially large PCB. Parameters of VIP560 1 power consumption: 5200W 2 top power: 800 W Bottom power: 800 W 3 bottom constant temperature power: 3.5KW 4 power supply: 220V± 10 50Hz± 3 5 dimension: 800× 500× 580mm 6 temperature control: K thermocouple 7 position: V slot PCB location 8 max PCB size: 400× 450mm 9 weight: 35~40kg Features of VIP560 1 with import components (temperature instrument, PLC, heater) which can control unsoldering accurately. 2 top zone and bottom zone heat independently, 8 segments warm-up and 8 segments constant temperture can be set, it can store 10 groups temperature profiles. 3 with import thermocouple to test temperature real time. 4 top heating and bottom heating are different temperature profiles, crosscurrent air motor can make PCB ametabolic. 5 with computer port, PC serial port, with testing temperature connector, with software to controlled by computer. 6 with alarm function after welding and unsoldering, it can cut off when temperature is abnormality, with protection function when it is over temperature. 7 it can deal with large capacity PCB, high temperature and lead free welding.