JINYU--802 machine is equipped with 8" super flat lapping plate and can be used as a high precision lapping machine for polishing crystal components, semiconductor wafers, and ceramic substrates up to 3" in diameter. It can be used as a standard grinding and polishing machine for preparing metallographic samples as well. Super-Flat 8" Lapping Plate Flatness < 0.25 micron / inch2 Precision Rotating Shaft Running Off < 3 micron Heavy Duty Cast Aluminum Case with Painting Color: Black or White Two Work Stations with 80 Rocking and adjustable speed 0 - 20 rocking / minute Two flat sample holders for carring < 3" dia. Wafer 80 Dia. X 35 T mm Two Condition Rings 95 O. D. X 88 I. D. X 32 T mm Variable Speed of Master Plate with Digital Display from 0 ~ 100 rpm Adjustable Timer for Auto-Stop 0 - 99 hours Automatic Slurry Feeder Optional for automatic polishing Power 120V or 240 V selectable via switch Motor 300 W high torque DC motor Dimension 525 L x 350 W x 325 H (mm) Weight (without packing) 99 lbs Warranty one year Package Dimension 27" x 22" x 20" Shipping Weight 120 lb Sample holder) Max wheel saw: 4" diameter Automatic shut off: Allow the saw to run unattended. Warranty: One year for all parts Package dimension: 19" x 15" x 15" Shipping weight: 38 lbs
