Die Bonders for IC Package (HS-DC01)

For IC LED DIP SOP SIP TSOP QFP LQFP PLCC SSOP BGA IC Card Crystal Oscillator etc package; UPH A. UPH≥18K chip size≤1.0mm B. UPH≥15K 1.0mmC. UPH≥10K 2.0mm Chip Size: 0.25mm*0.25mm-6mm*6mm Chip Thickness: 120um-750um Leadframe Dimension Length: 100mm-270mm (4"-10.6") Width: 15.2mm-76mm (0.6"-3.0") Thickness: 0.1mm-1.0mm (4mil-20mil) Magazine dimension Length: 100mm-270mm (4"-10.6") Width: 25.0mm-80.0mm (1.0"-3.15") Thickness: 70.0mm-150.0mm (2.76"-6.0") Material: Leadframe Alteration Time: Same leadframe and same IC: ≤25min Same leadfram but different IC: ≤10min Pin Height: 0mm-3mm (0min-120min) adjustable Bonding Head: Picking Pressure: 40g-200g adjustable Bonding Pressure: 40g-100g adjustable Rotary Bonding Head: 100° Wafer Table: Wafer Size: 8" (200mm), 6" (150mm) XY placement: ≥237.5mm*237.5mm (9.5"*9.5") Alteration Time: ≤10min (6" and 8" alter each other) Dispenser: Make sure no void below the chip Rotary scope: 100° Accuracy:XY (3 sigma) ± 25um Φ(3 sigma) ± 1.5°