Reflow Oven/Mini-Type Lead Free Reflow Oven (T200C)

Desk Reflow Oven Features: Cost-effective Desk Reflow Oven utilizes forced air convection heating technology and PC software interface to make an accurate temperature profile quickly and easily. T200C+ is a fine temperature profile model with temp testing capable of lead-free soldering. PC interface software control and visional operation Heating mode: Infrared ray + Hot air convection Effective working table area: 360mm *230mm Real-time temperature testing function fills the blank of SMT industry overall world for adjusting the temperature at the real time. Patented heater installation® For heating evenly Patented forced air cycling and ventilating technology® For extremely uniform temperature profiling across the board. Patented oven door actuating device® For no vibration after PCB welding. It satisfies all welding requirements of 0201 resistance and capacitance, fine pitch QFP, SOP, PLCC, BGA, CSP and so on. It meets the requirements of small batch and multimode production. It is also suitable for laboratory and research institute.