Merallized Ceramics Substrates for Various Application

Various size to very tight dimensional tolerances Excellent mechanical, electrical and thermal characteristics Excellent solderbility and wettability Various sizes and pattern design Excellent bonding strength Excellent printed line definition Specifications Substrate : Alumina 96% Mo/Mn or W metallization Ni plating : Min. 1.010% of thickness Flatness : less than 0.3% of length Solder wettability : Min. 95%