Desk Lead-Free Reflow Oven (F3C)

Features: 1. With infrared and hot air cycle and centrifugal fan which is little noise and large air pressure, it is high successful welding. 2. The reflow oven can weld QFP, BGA, CSP, the min chip is 0402, 0.3mm space of IC. And it is suitable for single side, double side, multi size board. 3. Push-pull drawer, it is convenient for use. It can be used to unsolder, repair and other function. 4. Heaters can be used for long time and dont need clean. 5. It is easy to operate. Automatic welding and easy using. 6. It is suitable for small and middle enterprises, university and scientific research. This machine can test SMD in industry. Technology parameters: 1. Temperature segment: 50 segments which is the same with 50 temperature zones. It can simulate preheating, heating, heat preservation, cooling and other parameters. SMT temperature profile is the international standard. Customers can adjust temperature profile according to actual request. 2. Max PCB size: 250mm x 180mm 3. Highest temperature: 350C 4. Power: AC 220V 5. Rated power: 0.8KW 6. Weight: 10KG 7. Dimension: 530 mm x 330 mm x 250 mm. Add to Basket