Black Color PCB Electronic Potting Silicone HY-215
Technical Parameters for PCB Electronic Potting Silicone
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Properties index
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Part A
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Part B
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Before Curing
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Appearence
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Black fluid
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Colorless / yellowish fluid
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Viscosisty (cps)
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2500±500
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-
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Features when operation
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Mixing Ratio ( By weight)
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10:1
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Operating Time (25C /min)
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20~30
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Curing time ( hr, basically cured)
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3
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Curing time ( hr, perfectly cured)
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24
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Hardness(shore A)
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15+/-3
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After Curing
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Thermal Conductivity[W( m·K)]
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≥0.4
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Dielectric Strength( kV/mm)
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≥25
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Dielectric permittivity(1.2MHz)
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3.0~3.3
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Volume resistivity(Ω·cm)
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≥1.0×1016
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Fire Resistance
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94-V1
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(Pls note all data of PCB Electronic Potting Silicone Rubber with black color above is in 25C with 55% humidity conditions. We don't guarantee a same date if testing under different conditions, or when data was regenerated).
Warm Tips for for PCB Electronic Potting Silicone
1. Sealing pakage for storage. The mixture should be used up at once to avoid wasting.
2. Silicone belongs to non-dangerous goods, but keep away form mouth and eyes.
3. When it gets stratified after a period of storage, Please mix HY-210# evenly before using,
it does not affect the performance.
1. Sealing pakage for storage. The mixture should be used up at once to avoid wasting.
2. Silicone belongs to non-dangerous goods, but keep away form mouth and eyes.
3. When it gets stratified after a period of storage, Please mix HY-210# evenly before using,
it does not affect the performance.
Package for for PCB Electronic Potting Silicone
Shelf Life and Transportation
1. Twelve(12) months when stored at 25C in original unopened packages.
2. This is a non-dangerous product, it can be transported as general chemicals.
3. Products exceed the storage life should be confirmed normal before using.
1. Twelve(12) months when stored at 25C in original unopened packages.
2. This is a non-dangerous product, it can be transported as general chemicals.
3. Products exceed the storage life should be confirmed normal before using.
Technical Guidelines
1. Pls put part A and B in separate container and stir evenly before mixing the two
parts together.
2. Mixing Ratio part A:part B is 10:1
3. Bubble release if necessary, deaeration the mixture under 0.08 MPa for 3 minutes.
4. HY-215# is cured at roon temperature, so pls put it under room temperature after
pouring. It comes to next process when basically cured, and it takesabout 24 hours
for completely cured.
1. Pls put part A and B in separate container and stir evenly before mixing the two
parts together.
2. Mixing Ratio part A:part B is 10:1
3. Bubble release if necessary, deaeration the mixture under 0.08 MPa for 3 minutes.
4. HY-215# is cured at roon temperature, so pls put it under room temperature after
pouring. It comes to next process when basically cured, and it takes
for completely cured.
Further information for PCB Electronic Potting Silicone, please feel free to contact
Contact: Belami Deng
Skype: Belami Deng
E-mail：sales21@gdsilicone.com
Tel: +86-755-89212386
Fax:+86-755-89948030
Mobile：18988789545
Address:Building A, No.3, Hongling First Road, Liulian Shibi, Pingdi Street , Longgang District, Shenzhen, Guangdong, China
