|
|
|
- Desk Lead-Free Reflow Oven (F3C)
- Features: 1. With infrared and hot air cycle and centrifugal fan which is little noise and large air pressure, it is high successful welding. 2. The reflow oven can weld QFP, BGA, CSP, the min chip is 0402, 0.3mm space of IC. And it is suitable for s
- 2014-03-01 11:07 [China(Mainland)]
-
BEIJING TORCH CO., LTD.
[Not Verified]
|
|
Negotiable
|