Laser die-board cutting machine SF-1225 GSI The model: SF1225 GSI Working area: 1260*2460 mm Whole machine size: 3350mm*2220mm*1110mm Laser-type: Sealed CO2 laser tube Laser power: GSI 200W Cooling mode: Water-cooling and protection system Cutting Speed: 200mm-300mm/min Resetting position accuracy ± 0.05mm Graphic format supported: HPGL, PLT, AL, DXF Controlling software: DSP control system Compatible software: CorelDraw, AutoCAD, Photoshop Driving system: Panasonic Servo Working voltage: AC 220± 10%, 50-60Hz Operating temperature: 0-45 Operating humidity: 5-95% 1. The compact design of Mechanical structure, and the lathe bed have been tempering heat treated which is not easy to be deformed. 2. The machine is equipped with imported ball screws and guide rail, Panasonic servo motor, advanced control system, which can guarantee the high-speed and high-precision. 3. Adopt core optical components of reliable international brands: GSI optical maser from UK II-VI optical lens made in USA. 4. The single-head cutting and flight optical path make the adjustment of optical path more sample and reliable. 5. The thinkness of 15MM, 18MM, 20MM die-board can be cut arbitrary width, such as 0.45, 0.71, 1.05, 1.42 etc. Kerf uniform, consistent from top to bottom seam. Once turned on, the machine can work without waiting time. 6. Low cost and no gas consumption, only consume 7.5KW/H power.
