Equipment Performance This machine is designed for cutting the wafer in solar industry and electronic industry specially. The SYC50 adopts YAG Kr pump laser and acousto-optical modulating system, digital control X/Y worktable, step motor for driving, moving precisely under the control of computer, the professional control software can make the edit and revision of program more simply and show the motion track gradually, SYC100 adopts the YAG Xe-pump laser for impulse, it has the characters of low repeating frequency, narrow width of pulse, higher density of energy. The digital control X-Y worktable can finish any track of motion under the accurate control of computer, and it is designed for cutting the thick wafer specially. Applicable fields The SYC50 laser cutting machine is very suitable for cutting the wafer spall of sillicon rod. The SYC50 laser cutting machine is very suitable for cutting the wafer of electronic industry.Technical Index Technical Parameter Type specification SYC100 Wave lengh of laser 1.064 uM Laser power 100W Laser repetition frequency 100KHz-20khz Power supply 220V/50HZ/2KVA Cooling ways Integration constant temperature circulation wate cooling Working temperature 0-35 Working humidity 5-95% Package Standard Crate for export The whole machine include Air pump Exhausting Fan water chiller Accessory box tools, pipes, quality certificate etc.
