1Adopt best heating material to control disassemble and weld for BGA. 2Hot air and temperature can be adjusted, and generating high temperature rotate air. 3Moving heating head, easy operation. 4Temperature can be controlled independently on the top and in the bottom. Heating temperature can be displayed. 5Large power wind motor can cool rapidly to make PCB perfect. 6With different size hot air nozzle. It is easy to replace. 7Adjusting PCB frame with anti-scald protection design 8Support frame in the BGA welding district, adjust support height to avoid going down of welding district. 920 segments warm-up controlling, it can save 2 groups setting temperature profiles. 10With alarm and remind function after disassembly and weld. The circuit can cut off when short circuit. With super temperature protection function. 11Hand vacuum absorb pen to absorb BGA, the suction can be adjusted. 12It is suitable for lead and lead free welding. Parameters and specification Input voltage AC220V 50/60Hz 10A System power 1400W Heating power in the bottom/highest temperature 600W/350 degree Pre-heating area in the bottom 240*240MM Heating power of hot air head/highest temperature 800W/450 degree Temperature feedback RTD sensor, close loop control Flux of hot air head 8, 16, 24 L/Minute can be chosen Max chip size: 70mm× 70mm Min chip size: 1mm× 1mm Max chip weight: 55g Max PCB size: 350mm× 350mm Max thickness of PCB: 3mm Suitable chip BGA, CSP, LGA( Land Grid Array), Micro SMD, MLF, BCC Dimension: 545× 440 × 488mm Weight About: 20KGS Adjustment accuracy: 0.025mm Min foot space: 0.3mm
