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1). High efficiency (up to 20 %), less consumption. 2). Long life: Some light power measurement in the measurement equipment manufacturer of the laser light source change the initial He - laser into diode laser, in order to get the best machinery life (He - en general for 10 ^ laser life, while diode laser four HR for 10 ^ 5HR life, a difference of ten times), especially suitable for on-site long operation. 3). It can achieve a switch function instantly, so it is appropriate communication purposes. Semiconductor laser marking machine will be settled soon when starting, and with circuit modulation is very appropriate, such as the output pulse wave modulation method can be used measured distance (and He - en 30 minutes of laser must boot only stable, this is absolutely not the semi-conductor laser). 4). Available in different wavelength: Using periodic table, for example III/V family gaas chemical compounds can be made of laser diode, when the current is conveyed pn interface, because of through different compounds to send out all visible laser and not visible laser. Semiconductor laser just change the proportion of combined elements so as to change the different energy interval, and different energy interval, provide a different output wavelength. Because of the infrared and red wavelengths in communication and measurement, it is easily with the various sensors on with and get very wide range of purposes. 5). Mechanical properties aspects: Have strong, weight light advantages. Type: XN-DP50 Biggest laser power: 50W Laser wavelength: 1064nm Beam quality: M2 < 3.5 Laser repeat frequency: ≤ 50kHz Marking scope: 110 x 110mm (optional) Marking depth: ≤ 0.3mm Marking line speed: Acuities 7000mm/s Minimum line width 0.015 mm Minimum character size: 0.3 mm Repeat precision: ± 0.01 mm Input power: 1.3KW Electrical source: 220V/single-phase / 50Hz / 15A 6) Areas of application: 1. Metallic materials: Stainless steel, copper, iron, aluminum and other metal and alloy, are often used for watchcase, MP3, mobile phone hull etc. Laser marking. 2. Metal oxidation, phosphating, plating surface marking: Hardware products, U plate shell, etc. 3. EP materials laser marking: Electronic component packaging, IC, etc. 4. ABS plastic: Electrical housing, electronic products and other product serial number, LOGO, etc. 5. Ink and paint: Mobile phone key-press, panel, daily necessities, printing products.
