Laser Wafer Sawing System & Laser Wafer (TH-LWS20)

1. High-speed scribing, efficient, low defective index 2. No contact procession, no mechanical stress, improve quality greatly 3. CCD quick location function, synchronic and coaxial control function 4. High precision 2D linear movement and DD rotary worktable 5. Marble base, stable, low heat distortion 6. Precision numerical control system 7. Easy, simple and friendly operation interface 8. Scribing technical export system 9. High reliability and stability 10. Widely used for scribing and cutting of integrated circuit wafer, GPP diode wafer, GPP silicon controlled wafer and OJ wafer. In addition, laser engraving machine, laser welding machine, laser cutting machine, 3D laser engraving machine and other laser equipment fall within our business scope as well.