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1). 80 *190mm/2up, FR-42). 6 layers at 1.4mm thick3). 35 μm copper weight4). Green solder mask LPI/White legend5). ENIG surface finish6). Blind via from Layer 1 to layer 27). Via in pad plugged conductive resin
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1). 80 *190mm/2up, FR-42). 6 layers at 1.4mm thick3). 35 μm copper weight4). Green solder mask LPI/White legend5). ENIG surface finish6). Blind via from Layer 1 to layer 27). Via in pad plugged conductive resin
