SUMMARY: 1. New image recognition system- geometric match 2. High-precision servo drive system 3. PCB positioning system 4. Many kinds of snap-off 5. Torch special manual/automatic adjusted plate 6. Smart stencil structure clamping 7. Automatic and effective stencil cleaning 8. Easy to maintain the electrical separate structure 9. 2D solder paste printing quality inspection and analysis 10. Easy to use user-friendly Chinese/English operate interface Technology parameters Screen Frames Min Size: 737X300mm Max Size: 737X737mm Thickness: 25~30mm PCB Min Size: 50X50mm PCB Max Size: 300X300mm PCB Thickness: 0.4~6mm PCB Warpage: 11mm including PCB Thickness Transport Height: 910*0mm Transport Direction: Left-Right; Right-Left; Left-Left; Right-Right Transport Speed: Max 1000mm/s Programmable Board Location Support System: Magnetic Pin Automatic Up-down table Clamping System: Patented over the top clamping, side clamping, vacuum nozzle Print head: Integrated drive system Squeegee Speed: 0-300mm/sec Squeegee Pressure: 0.3~0.6MPa Squeegee Angle: 60C/45C Squeegee Type: Stainless steel(Standard), plastic Stencil Separation Speed: 0.1~20mm/sec Cleaning System: DryWetVacuum (Programmable) Table Adjustment ranges: X: 10mm; Y: 10mm; Θ : 5C Repeat Position Accuracy: 0.01mm Printing Accuracy: 0.025mm Cycle Time: <20s (Exclude Printing*Cleaning) Product Changeover: <5Min Air Required: 0.4MPa-0.6MPa Power Input: AC: 220± 10%V, 50/60Hz Control Method: PC Control Machine Dimensions: 1900(L)X2050(W)X1500(H)mm Machine Weight: Approx: 1300Kg.
