The de-soldering worktable BGA900-IR — Double dark IR Heating for saving nozzle price. — Independent heating and temperature control at top and bottom, alarm when welding finished — Red laser BGA chips centering system, easy to operate — Large area heating and preheating of Top 80× 80MM, bottom 200× 200MM — Suit to welding, removal or repair BGA, PBGA, CSP and variety of packages — Meet the multi-layer PCB substrate and unleaded welding requirements. — The station mainly targets motherboards and display card chip, (including Host Bridge ) of Laptop, Desktops, Switch machine, Video game device (including graphics chip etc ). Features of BGA900-IR: Double IR heating systems, can heating at the top of the components and the bottom of PCB at the same time, compared with the Cyclones, the heating process is more stable and avoid uneven heating of the PCB; The use of advanced infrared heating methods needn`t replace the heating nozzle, it also save the cost of investment. Advanced temperature system: Independent heating from top to bottom and independent temperature control, alarm function when welding finished, all this characteristics can be more convenient and comfortable. Fashionable appearance: Full black design, arc top heater, small size, and could be placed in a 400MM room. Chip centering system: Red laser BGA chips centering system, it is easy to operate. Large area heating and preheating system: Top heating 80× 80MM, bottom heating 200× 200MM. It could be easy to deal with large thermal capacity PCB and other lead-free soldering. Integrative design: All-purpose support and PING could fix big size PCB up well. So, it is easy to prevent warping and maintain some irregular motherboard. Economical investment: For small and medium enterprises and maintain department, it need not invest much money, you can get a high quality BGA repair station. Net weight: 15kg, It is easy to transport and convey.
