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BGA3100B function: 1. BGA3100B adopt integrative structure design to repair different size BGA QFP CSP and other chips. 2. BGA3100B is made up of manual optical position picking system hot air reflow welding system. Manual optical position picking system: A. High precision line orbit and rotary platform can achieve four degree adjustment of X-Y-Z and nozzle angle Φ (turn 360° ) B. Exact optical picking system is made up of CCD camera optical components and light supply which generate by double color prismatic technology (have been patent), it can observe and achieve superposition between PCB pad and foot of components. Max BGA size is 50*50mm. Accuracy position, easy operation, flexible pick. C. High definition CCD camera can provide two lines output signal, with Zooming in, adjusting, foci automatically, software operation, 30X optical lens, clearly showing BGA and PCB on the screen. D. The accuracy of BGA3100B is ± 0.02mm. Hot air welding system: 1Adopt best heating material to control disassemble and weld for BGA. 2Hot air and temperature can be adjusted, and generating high temperature rotate air. 3Moving heating head, easy operation. 4 There are two heating zone heat independently in the top and bottom. The first heating zone can control temperature, the second heating zone make PCB heat to get best welding effect. 5With different size hot air nozzle. It is easy to replace. 6Adjusting PCB frame with anti-scald protection design 7Support frame in the BGA welding district, adjust support height to avoid going down of welding district. 8 With computer interface, it can achieve software control; 9 Controlling software can display 2 temperature profiles, adjusting software to make sure welding effect. 11With alarm and remind function after disassembly and weld. The circuit can cut off when short circuit. With super temperature protection function. 12Hand vacuum absorb pen to absorb BGA, the suction can be adjusted. 13It is suitable for lead and lead free welding. BGA3100B technology parameters: Dimension 1100mm*720mm*620mm Total power 2000W Top heating power 800W Bottom pre-heating power 1200W Top hot air heating 800W Bottom infrared pre-heating 1200W Voltage 220V(50Hz) Controlling mode manual Picking accuracy ± 0.02mm Position system Double prismatic technology PCB size Max400*300mm, Min30*10mm PCB thickness 0.5-3mm Software controlling system Base on windows software Picking components size Max50*50mm, Min3.5*3.5mm Picking strength 2.0N Temperature controlling system Intelligent temperature controlling system, closed loop control PCB transmission Move by hand PCB drive Precision orbit Profile 40 segment temperature Weight About 50kgs Monitor (standard configuration) 14 inch 1 set Nozzle(standard configuration) 3 PCS BGA reball steel net (standard configuration)
