Ideal IC packing units; allowing easier adhering and component assembly of COF, TCP, and CMOS, as well as for the easy carrying and transportation of printed wiring
Available in low-hardness (low-molecular polysiloxane) and high-hardness (self-adhe
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Ideal IC packing units; allowing easier adhering and component assembly of COF, TCP, and CMOS, as well as for the easy carrying and transportation of printed wiring
Available in low-hardness (low-molecular polysiloxane) and high-hardness (self-adhe
