Brief Introduction
According to the requirement of photovoltaic industry development, our company develops a new
series of laser scribing machines, which can be widely used to scribe polycrystalline and mono cry
stalline silicon wafer, non-crystalline silicon solar cell, and to scribe and cut other substrate materi
al of semiconductors such as silicon, Ge, GaAs Material and so on.
Configuration
SIde Pumped Diode Nd-YAG laser system with 15,000 hours.
Sound-optical modular
Numerical controlled X,Y working table
Step motor drive controlled by computer
Vacuum adsorbing system
Special cutting software
Advantage
The system of the machine is developed with international prevalent modularization design and its
key components are all imported high-quality ones. It has gained customers’ acknowledgement a
nd authorization.
• It has the very good performance of high scribing speed
• High precision
• Comprehensive functions
• Simple operation
• Long workable time
• Long term stability