143337 YAG300 683

 
 
单价 面议对比
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发货 China(Mainland)付款后3天内
Payment Terms L/C,D/A,D/P,T/T,Western Union,MoneyGram
过期 长期有效
更新 2014-03-12 12:41
 
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QUESTT ASIA

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Brief Introduction

Laser cutting is using 1064nm wavelength pulse laser focus and eradiate on the surface of work piece. The surface heat diffuses inside of material through heat-conduction. Its numerical controlling system controls the pulse width, laser energy, peak value and repeatability accuracy of the machine and make material fusing, gasifying instantly for realizing cutting, welding, drilling by numerical controlling according to scheduled track.
The System is including laser generator, (external) laser beam transmission part, worktable (machine tool), main controlling cabinet, cooling system and computer digital controlling system (hardware and software) etc.. It has good beam quality, high reliability, and so many multi-functions like cutting, welding, drilling. It is suitable for cutting, welding, drilling work for metal materials and cutting, drilling work for IC ceramic board. It is an idea accurate high-efficient flexibility processing equipment

Advantage

Faster processing speed is faster, higher efficiency.
Smaller cutting slit, smoother cutting edge, bigger depth/diameter rate and depth/width
Small distortion, suitable for hard, fragility, soft material
No wear, no exchange problems, no mechanical distortion
Suitable for the special environment.

Typical application

It has been widely used in the field of aviation and space, weapon, warship, petrifaction, medical, instrument, micro-electron, auto mobile car and so on.
Suitable material: carbon steel, stainless steel, Al alloy, copper alloy, Ti alloy, nickel molybdenum alloy and so on.
Welding, drilling and cutting metallic materials with thickness less than 2mm. Sawing the diamond to pieces or welding the cluster gear of the automobile; heat treatment of surface quenching on the motor cylinder sleeve, the railway of machine and the roller etc.; and producing metallic Nanometer materials. It is also widely used in cutting and drilling on the ceramic substrate of thick or thin membrane circuit.

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