Laser 3D Subsurface Engraving Machine Laser Medium: Diode Pump Cooling system: Air cooler Laser Wavelength: 532nm Engraving frequency: 2 KHz Pulse Width: 7ns Single Point Power : 1.2MJ Quality of Laser Beam: TEMoo M2<1.5 Resolution: 500 Dpi Engraving Dimension Type C3: Max Ellipse(300mm*250mm)*100mm (Divide large scope into several parts for engraving, larger engrave scope can be specially designed ) Max Ellipse(300mm*250mm)*100mm Engraving speed: 1500 dots/second Input Power Standard: 220V/110V, 50Hz Power Consumption: 0.6KW Dimension of Mainframe Option C3: L 570mm*W 780mm*H 1000mm Weight C3: <110kg
