Laser 3D Engraving Machine: G-SN-C2 Laser 3D/2D Subsurface Engraving Machine is a new laser processing equipment that combines laser technology, computer technology and integrates optics, machinery and electronic. It adopts pulse laser and focuses it inside transparent materials to produce nanometer points of vaporous burst. Because the points can constitute splendid picture, pattern, and words inside glass controlled by computer, ordinary transparent materials can be made into grade luxurious art wares. Our series laser subsurface engraving machine usually fit to glass decoration industry, crystal gift industry, glass gift industry, glass and Plexiglas signs industry. It can also be used in secondary process industry of all kinds of bottles and other transparent materials Specification: Laser Medium: Diode Pump Cooling system: Air cooler Laser Wavelength: 532nm Engraving frequency: 2 KHz Pulse Width: 7ns Single Point Power : 1.2MJ Quality of Laser Beam: TEMoo M2<1.5 Resolution: 500 Dpi Engraving Dimension Type C1: Max 160mm*160mm*100mm Type C2: Max 190mm*160mm*100mm Engraving speed: 1500 dots/second Input Power Standard: 220V/110V, 50Hz Power Consumption: 0.6KW Dimension of Mainframe Option C1/ C2(L*W*H): 760mm*560mm*560mm Weight C1/ C2: 65 KG.
