Feature: Fluxless solder Programmable temperature profiles (up and down) Record of process data (. Csv /. Xls) Windows based software (UniSoft1 program (optional 20 programs), each with 16 (100) segments storable Process in gas atmosphere or vacuum Small footprint The Reflow Solder System RSS is developed for a small budget and space purpose. It Is an excellent tool for various solder processes and other applications. Some applications Are: As laboratory solder system for all kind of developers implementing and researching new processes, e. G. Fluxless soldering, flip-chip process, adhesive bonding, hermetic sealing under controlled atmospheres, solder bump reflowing, encapsulation of housings, soldering of power devices, heat treatment of semiconductor wafers, prototype research, quality control, environ- mental research purposes and for small pre-series or series. The chamber is hermetically sealed and equipped with a viewing window which allows observation of the samples during soldering process. The size of the heated surface is 210 x 210 mm, max. Temperature up to 350 C or 450C(option RSS-HT). One gas line with manual adjustable flow meter and digital display (electrical measured) is default, up to 4 gas lines are optional available. By using the formic acid option (RSS-FA) the carrier gas (e. G. Nitrogen) will be enriched with formic acid vapour and fed into the process chamber. This supports fluxless soldering by removing of thin oxide layers from the surfaces. As an alternative we offer the option RSS-H2 (hydrogen module); So the usage of 100% pure hydrogen is possible. Standard (inert) gases to be used are nitrogen or forming gas. By connecting an appropriate external vacuum pump the system is vacuum capable up to 10-3 Mbar (optional up to 10-6 mbar = model RSS-210-HV).
