The Reflow Solder System RSS is developed for a small budget and space purpose. It is an excellent tool for various solder processes and other applications. Some applications are: As laboratory solder system for all kind of developers implementing and researching new processes, e. G. Fluxless soldering, flip-chip process, adhesive bonding, hermetic sealing under controlled atmospheres, solder bump reflowing, encapsulation of housings, soldering of power devices, heat treatment of semiconductor wafers, prototype research, quality control, environ- mental research purposes and for small pre-series or series. The chamber is hermetically sealed. The total heated area is 630 mm x 210 mm for parellel processing of up to 12 wafers with 100 mm diamter each. The maximum temperature is up to 300 C One gas line with manual adjustable flow meter and digital display (electrical measured) is default, up to 4 gas lines are optional available. By using the formic acid option (RSS-FA) the carrier gas (e. G. Nitrogen) will be enriched with formic acid vapour and fed into the process Chamber. This supports fluxless soldering by removing of thin oxide layers from the surfaces. As an alternative we offer the option RSS-H2 (hydrogen module) which allows the usage of 100% pure hydrogen. Standard (inert) gases to be used are nitrogen or forming gas. By connecting an appropriate external vacuum pump the system is vacuum capable up to 10-3 mbar. Key features are precise controlled fast ramp rates up to 120 K/min for ramp up and up to 60 K/min for ramp down (depending on loading). The process is programmed by the internal controller which is provided with the UniSoft Software. The process is controlled either directly at the controller (a display shows the current status) or by using the USB to PC interface. This allows storage of an unlimited number of programs. So all temperature profiles and segments can be saved. An additional feature is the choice between precisely programming the ramp-rate or the time-to-target value.
