The Reflow Solder System RSS is developed for a small budget and space purpose. It is an excellent tool for various solder processes and other applications. Some applications are: As laboratory solder system for all kind of developers implementing and researching new processes, e. G. Fluxless soldering, flip-chip process, adhesive bonding, hermetic sealing under controlled atmospheres, solder bump reflowing, encapsulation of housings, soldering of power devices, heat treatment of semiconductor wafers, prototype research, quality control, environ- mental research purposes and for small pre-series or series. The chamber is hermetically sealed and equipped with a viewing window which allows observation of the samples during soldering process. The size of the heated surface is either 110 x 110 mm (model RSS-110) or 160 x 160 Mm (model RSS-160), max. Temperature up to 350 ° C or 450 ° C (option RSS-HT). One gas line with manual adjustable flow meter is default, up to 2 gas lines (plus one additional gas line with formic acid module) are optional available. By using the formic acid option (RSS-FA) the carrier gas (e. G. Nitrogen) will be enriched with formic acid vapour and fed into the process chamber. This supports fluxless soldering by removing of thin oxide layers from the surfaces. As an alternative we offer the option RSS-H2 (hydrogen module); So the usage Of 100% pure hydrogen is possible. Standard (inert) gases to be used are nitrogen or forming gas. By connecting an appropriate external vacuum pump the system is vacuum capable up to 10-3 mbar. Key features are precise controlled fast ramp rates up to 120 K/min for ramp up and up to 100 K/min for ramp down (depends on loading and model). The process is programmed by the internal controller which is provided with the UniSoft Software. The process is controlled either directly at the controller (a display shows the current status) or by using the USB to PC interface. This allows storage of an unlimited number of programs. So all temperature profiles and segments can be saved. An additional feature is the choice between precisely programming the ramp-rate or the time-to-target value. This tool is a low cost solution for various applications and industries. A further advantage is the minor size of the system.
