Desk Reflow Oven Features: Cost-effective Desk Reflow Oven utilizes forced air convection heating technology and PC software interface to make an accurate temperature profile quickly and easily. T200C is a fine temperature profile model capable of lead-free soldering. PC interface software control and visional operation Heating mode: Infrared ray + Hot air convection Effective working table area: 360mm *230mm Patented heater installation® For heating evenly Patented forced air cycling and ventilating technology® For extremely uniform temperature profiling across the board. Patented oven door actuating device® For no vibration after PCB welding. It can be used to solidify SMT -Adhesive. It satisfies all welding requirements of 0201 resistance and capacitance, fine pitch QFP, SOP, PLCC, BGA, CSP and so on. It meets the requirements of small batch and multimode production. It is also suitable for laboratory and research institute.
