Silicon Wet Etching Machine Function: 1. Production Rate: 1600 (125 * 125, 156 * 156)PCS/hours (can order) 2. Using the fourth generation with the latest auto liquid, a full complement of anti-acid, anti-corrosion measures to protect the whole machine. 3. New auto infusion techniques. 4. Unique and mature silicon drying technology to ensure the wafer drying without leaving any water marks. 5. The large color screen man-machine interface, convenient parameter setting and the multi-process mode conversion. 6. High-speed transfer upload Panasonic servo robot process control, high-speed, pressure, auto be converted, stable four-point crawl, hook hold baskets and so on. Add to Basket
