Full auto BGA Repair System Specification PCB dimension: W20*20~W450*W400mm PCB thickness: 0.5~4mm Applicable chip size: 1*1~70*70mm PCB locating way: Outer or jig Working table adjustment: +/-10mm forward/backward, +/-10mm left/right Temperature control: K-type thermocouple, close cycle controlled Preheater: Far infrared, 3600W Top heater: Hot air, 1000W Bottom heater: Hot air, 1000W Power supply: Single-phase 220V, 50/60Hz, 6KW Gas supply: 5~8kgf/cm2, 60L/min Machine dimension: L780*W850* H950mm Weight: Appox. 150Kgs Features * Hot air head and mounting head are designed 2 in 1, and have both the auto soldering and Mounting function; * Color optical system with functions of split vision, zoom - in and micro- Adjustment, equipped with aberration detection device; With auto focus and software Operation function, 22X optical zoom; Able to rework BGA sized up to 70mm× 70mm; * Touch screen interface, PLC control; Able to display temperature curves and five detecting Curves at the same time; * Color LCD monitor; * Built-in vacuum pump; 360° Rotation in Φ Angle; Mounting nozzle is micro-adjustable; * 6 segments of temperature up (down) and 6 segments constant temperature control, 200 Groups of temperature curve are stored; Curve analysis can be carried out on the touchScreen and has the communication function as computers, with software attached; * Able to arrive at three independent temperature zones, temperature and time can be Displayed digitally on the touch screen; Able to rework CGA; * The supports rack can be adjusted to restrain the local sinkage of the BGA soldering area; * Suction nozzle can identify material and mounting height automatically, and can control the Air pressure within a small range; * Both upper and lower hot-air heating head are movable on the IR preheating area to fit for Reworking BGA in different positions on PCB; * Equipped with different alloy hot air nozzles, easy to replace and able to locate in any angle. * Driven by the servo motor, the integrative hot air head can store 20 groups of different BGA Heating points and register marks.
