BGA machine(AT400) 1. Upper hot air heater head and mounting head are designed 2 in 1, have both the auto soldering and mounting function, auto memorize operating position; 2. Upper heater has a special rapid cooling function toward BGA, meets lead free technology; 3. X, Y, Z table are driven by serve motor, operated by rocker; Can micro-adjust when getting close to the target point, Min resetting precision 0.01mm; 4. Color optics alignment system with functions of split vision, zoom in/out and micro-adjust, equipped with aberration detection device; 5. With auto focus and software operation function, 22 X optical focus, able to rework BGA sized up to 70× 70mm; 6. Suction nozzle can identify material and mounting height automatically, nozzle can be rotated 360° , and can control the gas pressure within a small range; 7. Nitrogen can be used for protecting soldering & desoldering; 8. Embedded industrial computer, touch screen interface, PLC control, real-time profile display, able to display set profile or 9 practically-tested profiles; 9.8 segments of temperature up(down) and 8 segments constant temperature control, no limited profiles are stored; Profile analysis can be carried out on the touch screen; With computer communication function, communication software is attached; 10. Three heaters(upper/lower hot air heater, bottom IR heater) heating independently, can rework BGA on any place of the PCB; 11. Pick up BGA and move it to the place for solder automatically; 12. Drive BGA to destination after desolder automatically; 13. Equipped with monitoring camera to observe the whole reworking process, balls melting status can be seen through the camera;
