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packing
  • packing
  • our production range:--- all kinds of nylon and polyester travel bag school bag and fashion bags
  • 2014-03-14 21:54  [China(Mainland)]
  •   XIAMEN C&D INC.  [Not Verified]
Negotiable
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Die Bonders for IC Package (HS-DC01)
  • Die Bonders for IC Package (HS-DC01)
  • For IC LED DIP SOP SIP TSOP QFP LQFP PLCC SSOP BGA IC Card Crystal Oscillator etc package; UPH A. UPH≥18K chip size≤1.0mm B. UPH≥15K 1.0mmC. UPH≥10K 2.0mm Chip Size: 0.25mm*0.25mm-6mm*6mm Chip Thickness: 120um-750um Leadframe Dimension Length
  • 2014-03-14 21:48  [China(Mainland)]
  •   DALIAN JAFENG ELECTRONICS CO., LTD.  [Not Verified]
Negotiable
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Package PP Strapping Band Extrusion Line
Negotiable
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