BGA chip repair machine ZM-R680D 1: Top power: 64W Top heater: 1200W Bottom heater: 2nd 1200W 3rd IR heater3900W; Good solution for repair any BGA/CGA/VGA chipset 2: 3 independent heaters for work out BGA heating or falling profiles: Top-hotair bottom-hotair IR preheat areas(6pcs Germany heating plate 3: V-groove, PCB support adjusted in any direction, external universal fixture 4: K-type thermocouple closed loop, heating independently temperature precision within P/N 1 degree. Ensure the BGA rework with good quality and performance. 5: Omron Relay+Germany heating plates(6pcs)+Ming WeiPower +High sensitivtytemperature module 6: Motor drive, CCD color high definition imaging system, Camera magnification: 3× -54× Watching BGA reballing matches with PCB/motherboard effectively and complete the positioing with correctly and skillfuly. 7: X, Y axis and R angle with micrometer adjust, accuracy within P/N0.01MM 8: NW: 80KG 9: Repair lead free requirements on Socket775, double BGA, CGA and IC various shielding devices. Meet lead-free requirements 10: 7.0'', Resolution 640*480, Panel Visa touch screen, external USB port for downloading the BGA work profiles, easy for analysis job
