Features: 1. Imported high-precision materials (temperature sensor, PLC, heater) to control the BGA desoldering & soldering procedures precisely. 2. Top/bottom bga chipset temperature areas heat independently and more accurately. The first and second temperature areas can set up 8 rising temperature segments and 8 constant temperature segments It can save 10 groups of graph parameters at the same time. The third area uses far-infrared heater to preheat and control the temperature independently, so that the PCB can be fully preheated during the desoldering process and it can be free from deformation. 3. Imported high-precision thermocouple to detect the top/bottom temperature precisely. 4. In the upper part, the heating head and the mount head are designed 2 in 1 to weld and mount automatically. 5. Adopt high-precision auto-place system with enlarge & micro-adjust function. The machine is equipped with a 15° Color LCD monitor. 6. After finishing bga reballing desoldering & soldering, there is an alarming. When the temperature goes beyond control, the electric circuit can cut off automatically, with over-heating protection. 7. The mounting nozzle with a built-in vacuum pump can rotate 45° , and the suction force can be adjusted. 8. Use a V-groove equipped with a flexible fixture for PCB with bga chipset positioning to protect the PCB from deformation when heated or cooled. 9. Offer BGA nozzles of different sizes to change easily. For large thermal capacity of PCB or other high-temperature and lead-free welding requirements, all can be handled easily. 10: Easy to operation and workout bga chipset rework 11: Before start this bga machine, please check theinstruction book, and get some reminder. 12: Work performance is great for bga rework
