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Material available *FR-4 normal TG *FR-4 TG170 *FR-4 High CTI>600V *RO4350B *RO4003C Dielectric material & Stack up requirement FR-4(no copper): 0.05-3.2mm for option Prepreg type: 7628H(7630), 7628(43%), 7628(41%), 2116HR, 2116, 2113, 1080 and 1060 for option Copper weight: 17-175um for option Technical & Services *4-32 layer count *0.5-6.0mm thick *Impedance control *Blind vias, Via in pad, * Gold finger *BGA,CSP,QFN *Rogers+FR4 combination *ENIG, HASL, Immersion Silver *Prototype *Mass production *Door to door shipment Applications Laptop computer Server DRAM module Television Game player Set-top-box Wireless phone Communication device Automotive electronics etc
