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PCB Process Capability *processing layers:1-28 layers*Finished thickness (thinnest - the thickest): 0.008 "~ 0.24" (0.20mm ~ 6.0mm)*Minimum aperture: 6mil (0.15mm)*Minimum line width / spacing :3-4 mil (0.076-0.10mm)*Maximum board size: Single & Double 22 "x 43" (550 x1100mm), Multi-layer 22 "x 25" (550mm x 640mm)*Impedance Control: ± 10%*Surface Treatment: OSP, HASL, Electric Nickel / Gold, Chemical nickel / gold, lead-free HASL , Gold finger, immersion Silver, Immersion Tin.*Base materials: FR4 ( ShengYi, KB, International), high TG (TG150, TG170), halogen-free board (Halogen-free), high frequency plate (Rogers, Teflon, Taconic), made PTFE (PTFE) ,, AL aluminum plate (Berquist, Al-made basis), copper (Cu Base), Iron (Fe Base), ceramic substrate (Ceramic Base)
