6-axis linkage, driven by 7 electric motors; Rocker control for air head/PCB and optical alignment system motions in X/Y axis, easy operation; With memory function; Suitable for mass repair, high efficiency; High automation degree. Hot air head and mounting head integration design, with auto soldering and desoldering functions. Upper/lower heaters adopt Hot air & IR mix heating. Upper heater uses two-path and direct-injection way. IR acts on the heating area directly; In the meanwhile, hot air works. They interact to heat quickly, and keep temperature even. (heating-up speed is up to 10° C/S) Independent 3 heaters, upper and lower heaters can realize linkage and move within bottom pre-heating area along X/Y axis. Lower heater can move up/down and support PCB, auto-controlled by motors. The upper and lower heater able to move towards target BGA, without moving PCB. Unique bottom preheating table made of Germany-imported good quality heating materials "plated IR tube" & constant temperature glass "anti-dazzle" (heat-resist up to 1800° C), pre-heating area up to 500*420mm Preheating table, clamping device and cooling system can move integrally in X axis that make PCB locating & desoldering safer and conveniently The unique design of integral movement in X/Y axis, make the best of space.; Small-sized device accomplishes big PCB rework needs; Max. PCB size up to 630*610mm; No rework dead space Initiative: Quick Location" system and rocker location method make locating more quick and convenient. The clamping device with locating scales; System can memorize previous locating scales that makes repetitive locating very quick and convenient Auto-place BGA chips on jigs with locating scales Inbuilt vacuum pump, rotatable 360° InΦ Angel, step motor drive, with memory function; Fine-adjusting mounting suction nozzle. Suction nozzle can detect BGA pickup and mounting height automatically with pressure controllable within 10 grams; Zero pressure available to smaller BGA pickup and mounting. Color high-resolution optical vision system, with split vision, zoom in and fine-adjusting functions, aberration distinguish device included, auto-focus, software operation 22x optical zoom; Reworkable max. BGA size: 70&70mm Embedded industrial computer, touch screen interface, PLC control with real-time temperature profile display; Both setting profile and real temperature profile can be displayed. Upper/lower heater with 10 segments of temperature up (down) and 10 segments of constant temperature control, industrial computer can save temperature profiles without limit; Can analysis profiles on the touch screen Many sizes of alloy nozzle, easy for replacement; Can locate at all angle With 5 thermocouple ports, can real-time detect and analyze temperatures at multipoint. Equipped with two independent air supply, can connect with Nitrogen or compressor air, or interchange them, makes desoldering safer and more reliable. Technical parameters Model No: KID-R800 Max. PCB size: L630*W610mm PCB thickness: 0.5~5mm Applicable BGA size: 1*1~70*70mm Min ball pitch: 0.15mm Max. Weight of BGA: 150g Placement accuracy: ± 0.01mm PCB locating way: Outer or location hole Temperature control way: K-type thermocouple, close loop control Lower heater: IR+Hot air 800W Upper heater: Hot air 1200W Bottom preheating: IR 6000W Power: Three phase 380V50/60Hz Machine size: L970*W700*H1400mm(exclude frame) Machine weight: Approx. 170KG
