BGA Rework Equipment (KID-R580)

 
 
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发货 China(Mainland)付款后3天内
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更新 2014-03-04 11:10
 
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SHENZHEN W-KIDI TECHNOLOGY CO., LTD.

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Specification: Hot air head and mounting head integration design, direct heating after mounting without moving PCB to avoid BGA misplaced, dual-speed motor drive, hot air head moves up and down by hand. New-style hot air and IR mixed 2 in 1 for upper head heating; Temperature rises fast, which leads to the big temperature difference between BGA and others around with no effects on them; Suitable for PCB with small pitch between components. Three separate heating areas, upper/lower hot air and bottom IR; Heating time and temperature can display on the touch screen. Large movable bottom pre-heating area, PCB clamping device can be flexibly adjusted on X/Y-axis; Reworkable Max. PCB size 550*550mm. Powerful cross flow fan cools down the lower heating areas quickly. Color high-resolution optical vision system with split vision, zoom in and fine-adjusting functions, aberration distinguish device included, auto-focus, software operation, 22x optical zoom, reworkable BGA size range 1.5 * 1.5 mm ~70*70mm. Embedded industrial computer, touch screen interface, PLC control with real-time temperature profile display; Both setting profile and real temperature profile can be displayed; Inbuilt vacuum pump, rotatable 60° In Φ Angle, fine-adjusting mounting suction nozzle. Upper/lower heater with 8 segments of temperature up (down) and 8 segments of constant temperature control, industrial computer can save temperature profiles without limit; Can analysis profiles on the touch screen. Suction nozzle can detect mounting height automatically with pressure controllable within 10 grams. Many sizes of alloy nozzle, easy for replacement; Can locate at all angle. Color optical vision system manually operated. Equipped with thermocouple port, real-time temperature monitoring and analyzing functions. Technical parameter Model No: KD-R580 Max. PCB size: L550*W500mm PCB thickness: 0.5~5mm BGA size: 1*1~70*70mm Min ball pitch: 0.15mm Max. Weight of BGA: 150g Mounting accuracy: ± 0.01mm PCB locating way: Outer Work table adjustable: Forward/backward ± 10mm, left/right± 10mm Temperature control way: K-type thermocouple, close loop control Lower heater: Hot air 800W Upper heater: IR+hot air 1200W Bottom pre-heating: IR 3600W Power: Single phase 220V, 50/60 Hz Machine size: L850*W750*H630mm Machine weight: Approx. 80KG

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